OCP kick off – Optical, Packaging, Memory and Power in focus

AI infrastructure innovation is shifting toward rack-level co-optimization, creating opportunities in optical interconnects, advanced packaging, memory architectures, and power delivery as agentic AI drives inference demand. CPO: Optical scale-up is getting closer to reality. A 64-XPU CPO-enabled compute-rack demonstration highlighted the potential for direct optical links between accelerators. As 200G/lane electrical channels approach physical limitations, optical scale-up will become more important, particularly for customized XPUs. However, pluggable optics should retain scale-out volume leadership given advantages in serviceability and cost;